Multi-Chip Package (MCP)

Viking Technology’s Multi-Chip Package (MCP) is part of the extreme density line of DDR4 memory products optimized for the embedded, industrial, and military/aerospace markets. Our DDR4 MCP products achieve significantly higher memory performance and density per cubic inch than conventional memory DIMMs.

These performance and density milestones will critically change the way future system hardware is designed and deployed.

Product Brief Inquiry

MILITARY-GRADE HIGH-DENSITY MEMORY

Military, Defense & Aerospace Deployments

SWaP Optimized with Customization

Shock & Vibration Tested

-55°C to +125°C

RUGGED HIGH-DENSITY SWaP MEMORY

At 8GB & 16GB density, with data width of X32, X40, and X72, Viking’s DDR4 Multi-Chip Package (MCP) memory module configurations are ideal for applications utilizing computer modules of COMe, PC/104, SMARC, Qseven, XMC, AMC, and most custom embedded systems.

Speeds	Temperature	Reliability	Voltage
2133/2400/2667 (DDR4)	0ºC to +70ºC (Commercial temp)	Standard DDR4 DRAM	1.2V (DDR4)
	-40ºC to +85ºC (Industrial temp)
	-40ºC to +105ºC (Automotive temp)
	-55ºC to +125ºC (Military temp)

EXTENDED FEATURES

Very small footprint: Saves up to 85% board space vs. Standard DIMM Modules
Rugged: Soldered-down PBGA – No DIMM connector
Very high memory capacity per cu. in.
Superior signal integrity
Very high memory bandwidth per cu. in.
Lower cost motherboard due to easier DDR routing

POWERFUL & COMPACT

Compact and rugged DDR4 Memory Module Multi-Chip Package (MCP) designed for SWaP optimized applications. Viking’s Multi-Chip Package memory is built to deliver rugged reliability and durability for harsh environments.