DDR4

Viking Technology DDR4 memory solutions harness cutting-edge packaging expertise, locked BOM control, and are produced in AS9100, TL 9000, and ISO 14001 certified facilities. This ensures the delivery of top-tier memory modules tailored to meet the rigorous demands of both Enterprise and Embedded markets. Each module undergoes thorough testing to meet the requirements of blade servers, AdvancedTCA, MicroTCA, Single Board Computers (SBC), and other various nterprise appliances.

Viking Technology’s DDR4 Memory modules offer densities of up to 128GB, with temperature ranges 0°C to +95°C (commercial), -40°C to +95°C (industrial), and -55°C to +125°C (military).

Moreover, Viking Technology employs DRAM stacking capabilities within the DDR4 memory family, enabling higher density modules at a reduced cost compared to DDPs or single die monolithic devices.

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DDR4 Memory Module

DDR4 MEMORY MODULE

HIGH PERFORMANCE

Icon High Performance

Thin form factor in a variety of sizes for increased performance & capacity

EXTENDED TEMPERATURE

Extended Temperature icon

-55°C to +125°C

HIGH PERFORMANCE MEMORY

Viking Technology’s High Performance Memory Modules are suitable for the most demanding environmental conditions in industries that require the benefit of high density in a very low profile form factor.

Viking Technology’s line of memory/storage solutions with extended temperature support are built with the most stringent of requirements in mind, with extreme temperature ranges, high humidity support, shock resistance, and ruggedization. Viking’s extended temperature solutions ranges from standard commercial (0°C to +70°C) & industrial temperatures (-40°C to +85°C) as well as customized temperature ranges of up to +170°C. These extended temperature solutions can be found in applications used in mountainous regions to deserts and even in arctic conditions for Oil and Gas down-hole drilling. Beyond the temperature ranges, each solution can be customized as a ruggedized memory/storage device built to resist larger amounts of shock and vibrations. These solutions offer the utmost in performance and reliability in challenging, real-world conditions.

FORM FACTOR CAPACITY FORM FACTOR CAPACITY
LRDIMM Up to 256GB VLP MiniRDIMM Up to 16GB
RDIMM Up to 256GB VLP MiniUDIMM Up to 16GB
UDIMM Up to 128GB ULP MiniRDIMM Up to 16GB
VLP RDIMM Up to 32GB ULP MiniUDIMM Up to 16GB
VLP UDIMM Up to 32GB SORDIMM Up to 32GB
ULP RDIMM Up to 16GB SOUDIMM Up to 32GB
MiniRDIMM Up to 16GB VLP SORDIMM Up to 16GB
MiniUDIMM Up to 16GB

EXTENDED FEATURES

  • Broadest DRAM Offering
  • JEDEC Standard
  • Customized Testing
  • Locked Bill of Materials (BOM)
  • Extending Burn-in Testing
  • Thermal Modeling
  • Ultra Small Form Factors
DDR4 Memory Module

SUPERIOR QUALITY, INNOVATIVE SOLUTIONS

SPECIALIZED DRAM PACKAGING TECHNOLOGY

Small memory module form factors such as SODIMMs, MiniDIMMs, and VLP DIMMs generally use specialized DRAM packaging technologies to achieve high density solutions.

  • Lower cost modules compared to those assembled using costly DDP’s or high density single die monolithic devices
  • Short lead times and minimum order quantities
  • Stacking in performed in-house under Viking & Sanmina-SCI quality control

MARKETS SERVED

Enterprise Computing | Enterprise Storage | Servers | Embedded & Industrial

DDR4 Memory Module